Technological watch
Nordson MARCH to Present Paper on Plasma Applications for Wafer-Level Packaging at ICEPT
CONCORD, Calif.--(BUSINESS WIRE)--NDSN), a global leader in plasma processing technology, will present the paper, "Plasma Applications for Wafer Level Packaging, Part 1," at the 20th annual International Conference on Electronic Packaging Technology (ICEPT) in Hong Kong 11-15 August 2019. The session will be held on August 14 at 11:55 AM.
Dr. Jiangang (Jack) Zhao will discuss typical plasma applications that enable or improve process steps for wafer-level packaging (WLP) and present original data. As shown by the results, plasma treatment is the recommended process to improve interface adhesion and reduce the current leakage in WLP, as well as oxide removal from surfaces, avoiding micro-voids between the WLP layers.
“The first-hand data indicate that plasma can be used especially for improving platinum-copper (Pl-Cu) interface adhesion and eliminating possible micro-voids between the Cu seed layer and the electrically plated Cu layer during electroplating,” stated Dr. Zhao, applications director and chief scientist, Nordson MARCH. “The use of proper plasma recipes is very important for addressing the challenges of these WLP applications.”
A globally recognized expert in plasma technologies and author of numerous plasma studies, Dr. Zhao has worked for Nordson MARCH since 2001. He holds a doctorate in chemical engineering from the University of Missouri-Columbia and has worked in the plasma application field for 25 years and the IC packaging and coating industries for 20 years. Dr. Zhao is also an adjunct professor of Donghua University in China.
Other plasma treatments to be discussed in this paper include TSV cleaning, EMC removal from solder balls on wafer, and wafer-on-frame treatment. The presentation will be held during the ICEPT technical sessions in the Hong Kong Science Park, Shatin, Hong Kong, China.
For more information, contact Nordson MARCH at info@nordsonmarch.com or visit the website at https://www.nordson.com/~/media/Images/Nordson/march/PR-high-resolution/Zhao-Presentation-NordsonMARCH-StratoSPHERE-Plasma-Treatment
About Nordson MARCH
Nordson MARCH designs and manufactures a complete line of award-winning and patented plasma treatment systems that improve product reliability and increase production yields. Delivering over 30 years of continuous innovation semiconductors, microelectronics, and www.nordsonmarch.com, Twitter.
About Nordson Corporation
Nordson Corporation engineers, manufactures and markets differentiated products and systems that dispense, apply and control coatings, sealants, fluids, treat and cure surfaces, and are supported by application expertise and direct global sales and service. Nordson serves many consumer non-durable, durable and technology end-markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, construction, and general product assembly and finishing. Founded in 1954, headquartered in Westlake, Ohio, Nordson has operations and support offices in nearly 40 countries. Visit Nordson at Twitter or
Dr. Jiangang (Jack) Zhao will discuss typical plasma applications that enable or improve process steps for wafer-level packaging (WLP) and present original data. As shown by the results, plasma treatment is the recommended process to improve interface adhesion and reduce the current leakage in WLP, as well as oxide removal from surfaces, avoiding micro-voids between the WLP layers.
“The first-hand data indicate that plasma can be used especially for improving platinum-copper (Pl-Cu) interface adhesion and eliminating possible micro-voids between the Cu seed layer and the electrically plated Cu layer during electroplating,” stated Dr. Zhao, applications director and chief scientist, Nordson MARCH. “The use of proper plasma recipes is very important for addressing the challenges of these WLP applications.”
A globally recognized expert in plasma technologies and author of numerous plasma studies, Dr. Zhao has worked for Nordson MARCH since 2001. He holds a doctorate in chemical engineering from the University of Missouri-Columbia and has worked in the plasma application field for 25 years and the IC packaging and coating industries for 20 years. Dr. Zhao is also an adjunct professor of Donghua University in China.
Other plasma treatments to be discussed in this paper include TSV cleaning, EMC removal from solder balls on wafer, and wafer-on-frame treatment. The presentation will be held during the ICEPT technical sessions in the Hong Kong Science Park, Shatin, Hong Kong, China.
For more information, contact Nordson MARCH at info@nordsonmarch.com or visit the website at https://www.nordson.com/~/media/Images/Nordson/march/PR-high-resolution/Zhao-Presentation-NordsonMARCH-StratoSPHERE-Plasma-Treatment
About Nordson MARCH
Nordson MARCH designs and manufactures a complete line of award-winning and patented plasma treatment systems that improve product reliability and increase production yields. Delivering over 30 years of continuous innovation semiconductors, microelectronics, and www.nordsonmarch.com, Twitter.
About Nordson Corporation
Nordson Corporation engineers, manufactures and markets differentiated products and systems that dispense, apply and control coatings, sealants, fluids, treat and cure surfaces, and are supported by application expertise and direct global sales and service. Nordson serves many consumer non-durable, durable and technology end-markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, construction, and general product assembly and finishing. Founded in 1954, headquartered in Westlake, Ohio, Nordson has operations and support offices in nearly 40 countries. Visit Nordson at Twitter or
This project has received funding from the Bio Based Industries Joint Undertaking under the European Union’s Horizon 2020 research and innovation programme under grant agreement No 837761.
